About Xanadu:

Xanadu’s mission is to build quantum computers that are useful and available to people everywhere.

At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems, and literally change the world. And that is something to be excited about!

Your role and responsibilities:

As a key member of the Hardware Team in Toronto, your role as a packaging engineer is crucial. You will bring your experience in delivering ultra-low-loss chip packaging solutions to Xanadu's rack-scale quantum computer development. Your work will be instrumental in designing and testing the elements that make up our complex photonic full-build assemblies and producing robust optomechanical and packaging solutions.

Required qualifications and experience:

• BSc or higher in physics, mechanical engineering, materials science, electrical and electronics engineering or a relevant related discipline
• 3+ years of industry experience in a relevant discipline
• Experience with thermo-mechanical and stress simulations to achieve optimal thermo-mechanical stability and uniformity of photonic integrated circuits with large fibre arrays.
• Hands-on experience in optical and electrical packaging of complex photonic systems
• Hands-on experience with photonic wafer singulation and facet preparation
• Understanding the fundamental sources of loss in the basic passive and active photonic components.
• Proficiency in wafer scale and system-level characterisation and analysis.
• Self-motivated, comfortable working both independently and collaboratively with people of all disciplines on complex projects in a fast-paced environment
• Strong interpersonal skills

Preferred qualifications and experience:

• MSc in physics, mechanical engineering, materials science, electrical and electronics engineering or a relevant related discipline
• 5+ years experience in delivering photonic packaging solutions in an industry or industry-supporting role
• Experience in optomechanical CAD simulation, including stress and warp impacts of wire bonding and die attach
• Strong understanding of device assembly cost, testing cost and yield
• Experience in the simulation, fabrication and testing of complex active and passive photonics structures
• Experience in the simulation, fabrication and testing of complex active and passive MEMS

• Experience with root cause failure analysis (RCFA) and failure modes and effects analysis (FMEA).

At Xanadu, we are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier-free workplace. Should you require accommodations at any point during the recruitment process please contact Human Resources at hr@xanadu.ai.